VIRSEMI, OOO, Stavropol, Russia

Exhibitor of the 14th International Exhibition Composite-Expo 2022

March 29 - 31, 2022 / Pavilion 1, Expocentre Fairgrounds, Moscow, Russia

Exhibitor information:

Our company is engaged in the development and production of materials for the casing of semiconductor devices. The use of our compounds allows you to reduce the cost of production of semiconductor devices and the production of ICS. The reduction is achieved due to the absence of the need to use expensive injection molding equipment and tooling. With the help of our compound, it is possible to package devices in the simplest silicone forms, which is perfect for small- and medium-scale ECB production, R& D and serial production of them.

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